WINBOND-W25Q32JVSSIQ  

WINBOND-W25Q32JVSSIQ  

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Product Technical Specifications

EU RoHS Compliant 
ECCN (US) 3A991b.1.a.
Part Status Active
HTS 8542.32.00.71
Automotive No
PPAP No
Cell Type NOR
Chip Density (bit) 32M
Architecture Sectored
Boot Block Yes
Block Organization Symmetrical
Location of Boot Block Bottom|Top
Address Bus Width (bit) 24
Sector Size 4Kbyte x 1024
Page Size 256byte
Number of Bits/Word (bit) 8
Number of Words 4M
Programmability Yes
Timing Type Synchronous
Max. Access Time (ns) 6
Maximum Erase Time (S) 50/Chip
Maximum Programming Time (ms) 3/Page
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Minimum Operating Supply Voltage (V) 2.7
Maximum Operating Frequency (MHz) 133
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Programming Voltage (V) 2.7 to 3.6
Operating Current (mA) 25
Program Current (mA) 25
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Command Compatible Yes
ECC Support No
Support of Page Mode No
Minimum Endurance (Cycles) 100000
Packaging Tube
Supplier Package SOIC
Pin Count 8
Standard Package Name SOP
Mounting Surface Mount
Package Height 1.8
Package Length 5.28
Package Width 5.28
PCB changed 8
Lead Shape Gull-wing